Laser Annealing Equipment —— IGBT Backside Annealing Process


As one of the most widely used power devices, IGBT is applied in the fields of traffic & consumer electronics. SLD500 laser annealing equipment is specially designed for IGBT backside annealing mass production process.
   Product Features

● Warped wafer annealing

● Excellent optical system

● Ultra-thin wafer transfer

● Accurate thermal effect control

● High throughput


 Model  SLD500/20
Wafer Type  6/8/12" Wafer
Wafer Thickness Taiko≥50μm / Non-Taiko≥120μm
Scan Type  Scan & Step
Activation Depth  > 3μm(> 5μm Option)